| Single-Sided PCB |
One conductive copper layer on one side of the dielectric |
FR-4, CEM-1, CEM-3, or paper phenolic laminate |
Approximately 0.8–1.6 mm |
LED lighting, simple controls, power supplies, household devices |
Low-cost production; suitable for layouts with limited routing complexity |
IPC-6011; IPC-A-600 |
| Double-Sided PCB |
Copper layers on both sides with plated through-holes |
FR-4 and lead-free compatible laminate systems |
Approximately 0.8–2.0 mm |
Industrial controls, consumer electronics, automotive modules |
Supports through-hole and surface-mount assembly; more routing capacity than single-sided boards |
IPC-6012; IPC-A-600; IPC-A-610 |
| Multilayer PCB |
Three or more copper layers separated by dielectric prepreg |
FR-4, high-Tg FR-4, halogen-free laminates |
Approximately 1.0–3.2 mm; depends on layer count |
Computers, networking equipment, medical electronics, industrial systems |
Can include controlled impedance, buried vias, blind vias, and sequential lamination |
IPC-6012; IPC-2221; IPC-4101 |
| HDI PCB |
High-density multilayer structure using microvias and fine-line routing |
High-Tg FR-4, low-loss materials, thin dielectric systems |
Often approximately 0.6–2.0 mm |
Smartphones, compact computing devices, cameras, wearable electronics |
Requires laser drilling, sequential build-up, advanced registration control, and inspection |
IPC-2221; IPC-6012; IPC-6016 |
| Flexible PCB |
Flexible copper circuitry on a bendable polymer film |
Polyimide film, rolled copper, flexible coverlay |
Approximately 0.05–0.30 mm for the circuit area |
Displays, cameras, printers, medical devices, compact consumer products |
Designed for dynamic flexing or static bending; bend radius depends on stack-up and copper type |
IPC-6013; IPC-2223 |
| Rigid-Flex PCB |
Rigid board sections connected by integrated flexible sections |
FR-4 rigid materials combined with polyimide flexible materials |
Varies significantly by rigid and flexible zones |
Aerospace electronics, medical instruments, robotics, compact industrial equipment |
Reduces connectors and wiring; requires precise lamination and mechanical design control |
IPC-6013; IPC-2223; IPC-A-600 |
| Metal-Core PCB |
Copper circuitry over a dielectric layer bonded to a metal base |
Aluminum, copper, or other thermally conductive metal bases |
Approximately 0.8–3.2 mm |
LED modules, power converters, motor drives, automotive lighting |
Provides improved heat dissipation; thermal performance depends on dielectric conductivity and base thickness |
IPC-6012; IPC-4101; thermal design specifications |
| High-Frequency PCB |
Controlled-impedance circuit structure for high-speed or radio-frequency signals |
PTFE-based, hydrocarbon-ceramic, or low-loss laminate systems |
Commonly approximately 0.5–3.2 mm |
Radar, wireless communications, antennas, high-speed data equipment |
Requires dielectric-characterization control, impedance testing, and careful surface-finish selection |
IPC-6018; IPC-2221; controlled-impedance requirements |
| Ceramic PCB |
Conductive circuitry formed on or within a ceramic substrate |
Alumina, aluminum nitride, or other engineered ceramic materials |
Often approximately 0.25–1.5 mm |
Power electronics, high-temperature systems, LED packages, RF modules |
Offers high thermal stability and insulation; ceramic processing differs from conventional FR-4 fabrication |
IPC-6012 principles; application-specific ceramic substrate specifications |